With the electronic communications and other related information industry, the rapid development of the growing demand for integrated circuits, while its requirements are getting higher and higher. The core of modern electronic information technology is the integrated circuit, chip, and IC Lead Frames through the formation of integrated circuits. As the main structural material of the integrated circuit package, the IC Lead Frame plays an important role in the circuit, such as carrying the chip, connecting the chip and the external circuit board electrical signal, fixed installation, and so on. Its main functions are: connect the external circuit and transmit electrical signals; to the outside heat, play the role of heat; support and fixed the role of the chip, the overall support frame structure through the IC assembly, protection of internal components. It can be seen that the IC Lead Frame plays an important role in the integrated circuit device and the assembly program. How to effectively improve the thermal conductivity, conduction, strength, hardness, high softening temperature, heat resistance, oxidation resistance, corrosion resistance, Nature, repeated bending and processing performance has become the development of integrated circuits more prominent problem.
Intelligent development, and integrated circuits to large-scale and large-scale direction, to promote the IC Lead Frames toward the lead pitch miniaturization, multi-foot The direction of development. This requires a variety of performance of the IC Lead Frames material to be more excellent and comprehensive. Mainly in the following areas: the miniaturization of the IC Lead Frame requires that it should have a higher strength and hardness; the integrated circuit of high integration, high density of the unit to send more calories, which requires the IC Lead Frames material Excellent thermal conductivity; in view of the capacitor and inductance effect will cause adverse effects, good conductivity is the IC Lead Frames material must have the performance. In addition, there is a need for good hot and cold processing performance, bending, fine processing and etching performance, good brazing performance, the use of thermal peeling does not occur, good plating performance, resin adhesion and a series of good processing characteristic. Ideally, the strength of the IC Lead Frames material should be greater than 600MPa, the hardness HV should be greater than 130, and the conductivity (IACS) should be greater than 80%.
Japan, the United States, Germany, France and the United Kingdom and other countries are to master the copper-based alloy IC Lead Frames material production technology, the main producing countries, including Japan's fastest growing and alloy the most complete type. In the global market, the IC Lead Frames and its materials are mainly supplied by some multinational companies in Japan, Korea and Europe. Among them, large enterprises such as Shin Kong, Sumitomo, Mitsui and Fengshan have accounted for about 80% of the global IC Lead Frames market.
The IC Lead Frame materials used in integrated circuits and semiconductor devices are generally divided into two categories, namely, iron-nickel alloys and high-copper alloys. Its early use of the IC Lead Frames material is iron-nickel alloy, the material has high strength and anti-softening temperature and other characteristics, but its conductivity and thermal conductivity is poor. The high-copper alloy compared with the iron-nickel alloy in the conductive, thermal conductivity has a significant advantage in the field of IC Lead Frame materials to achieve rapid development.
From the 1960s onwards, Japan, the United States, Germany and other industrial developed countries on the high-strength high-conductivity copper alloy materials to do a lot of scientific and systematic research, while developing a variety of excellent performance of the IC Lead Frame copper alloy material, excellent performance Copper alloy materials are rapidly used in integrated circuits. The high strength and high conductivity of the IC Lead Frames material in the integrated circuit is the focus of the study.
In the 1970s, the copper alloy C19400, developed by Olin Brass, opened the curtain of high strength and high conductivity copper alloy materials. So far, the traditional Fe-Ni-Co alloy and FeNi alloy And other iron-based materials are gradually replaced. From the eighties of the last century, in order to meet the rapid development of modern industry and technology needs, the world has high-strength high-conductivity copper alloy materials research and development work. At present, more than 100 kinds of high strength and high conductivity copper alloy materials have been developed.
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